We can provide customers with Timepix assemblies. The Timepix chip was designed by CERN within the Medipix collaboration. It has a very complex structure, necessary for its unique ability to operate in three modes. More information on the technology can be found here.
The complex structure of Timepix makes the assembly of the chip a difficult and time-consuming process, which requires great expertise. At Amsterdam Scientific Instruments we have the experience, the skills and the facilities that are required for this process. This way we can offer our customers the option to have Timepix chips assembled by us (flip-chipping and bump-bonding).
The sensors used in the flip-chip bonding can be made out of a large variety of materials like Si, CdTe or GaAs.
For more information on this product offer, please contact us.